德律TR7500SIII介紹：
TRI頂尖的在線型AOI解決方案，提供超高速五支相機鏡頭的組裝電路板檢測，具有可靠的缺陷檢測功能，即使是最復雜的焊點以及組裝缺陷皆能檢出。TR7500 SIII搭載智能化軟件和高性能硬體的強大組合，提供可靠且易于使用的AOI解決方案，更致力于集中在高精度的檢測結果并將誤判降到最低，以幫助優化您的生產產量。
德律TR7500SIII特性：
1. 高精度五支鏡頭的多相AOI
2. 智能編程的GUI與離線編輯功能
3. 智能化自動輸送帶系統可減少進出板時間
4. 檢測可靠，高精度，低誤判
德律TR7500SIII規格：
Optical System
| Imaging Method | Dynamic Imaging |
| Top Camera | 4 Mpix |
| Angle Camera | 1.3 Mpix or 6.5 Mpix (factory setting) |
| Imaging Resolution | 10 μm, 15 μm (factory setting) |
| Lighting | Multi-phase RGB+W LED |
| 3D Technology | Single/Dual 3D laser sensors |
| Max. 3D Range | 20 mm (with 3D Laser Sensor upgrade optional) |
Inspection Performance
| Imaging Speed | 4 Mpix@ 10 μm 2D: 60 cm2/sec 4 Mpix@ 15 μm 2D: 120 cm2/sec |
Motion Table & Control
| X-Axis Control | Ballscrew + AC-servo controller |
| Y-Axis Control | Ballscrew + AC-servo controller |
| Z-Axis Control | N/A |
| X-Y Axis Resolution | 1 μm |
Board Handling
| Max PCB Size | TR7500 SIII: 510 x 460 mm TR7500L SIII: 660 x 610 mm TR7500 SIII DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane |
| PCB Thickness | 0.6-5 mm |
| Max PCB Weight | 3 kg |
| Top Clearance | 25 mm [48 mm optional] |
| Bottom Clearance | 40 mm |
| Edge Clearance | 3 mm [5 mm optional] |
| Conveyor | Inline Height: 880 – 920 mm * SMEMA Compatible |
Inspection Functions
| Component | Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Lifted Component |
| Solder | Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination |
Dimensions
| WxDxH | TR7500 SIII: 1100 x 1670 x 1550 mm TR7500L SIII: 1300 x 1630 x 1655 mm TR7500 SIII DL: 1100 x 1770 x 1550 mm Note: not including signal tower, signal tower height 520 mm |
| Weight | TR7500 SIII: 1030 kg TR7500L SIII: 1255 kg TR7500 SIII DL: 1150 kg |
